The ceramic mold is electroplated in order to better improve its performance and improve its quality. For the electroplating of the mold, the plated metal is oxidized as a cathode into a cation into the plating solution, and the metal cation to be plated is used as a cathode. The metal surface is reduced to form a coating.
At this time, it will eliminate the interference of the remaining cations, making the coating appear more uniform and firm. It is necessary to dissolve the plating metal cation as a plating solution, so as to keep the concentration of the metal cation of the plating layer from changing, thereby changing the surface properties and size of the plating mold substrate.
After comparison, it can be clearly felt that electroplating can effectively increase the corrosion resistance of ceramic molds, increase their hardness, prevent wear, improve electrical conductivity, lubricity, heat resistance and surface aesthetics, and prolong their service life and make A better quality product.
The ceramic mold plating layer is more uniform than the hot dip layer and is generally thinner, between a few microns. Through the electroplated substrate, decorative protective and various functional skin layers can be obtained on mechanical products, and wear and machining errors can be repaired.
Most of the ceramic mold coatings use a single metal or alloy, such as titanium target, zinc, cadmium, gold or brass, bronze, etc.; there are also dispersion layers, such as nickel-silicon carbide, nickel-fluorinated graphite, etc. There will also be partial overlays. In addition to iron-based steel and stainless steel, there are non-ferrous metals such as ABS plastic, polypropylene, polysulfone and phenolic plastics, but these materials must undergo special activation and sensitization before plating.