As the name implies, the is mainly used to produce ceramic welding pads, so it is also a typical ceramic mold. Since it belongs to the ceramic mold, the welding backing mold can also be electroplated to enable it to have ideal performance characteristics.
The purpose of electroplating solder mask molds is simple, in order to better improve its performance and improve its quality. For the plating of the mold, the plated metal is oxidized as a positive electrode into the plating solution as an anode and waits until the metal product to be plated as a cathode, and the plated metal cation is reduced on the metal surface to form a plating layer.
At this time, the interference of other cations will be eliminated to make the coating more uniform and firm. It is necessary to dissolve the plated metal cations as a plating solution so that the concentration of the metal cations of the plating layer does not change, so that the surface properties and the size of the substrate of the plating mold can be changed.
Facts have proved that electroplating can effectively increase the corrosion resistance of welding backing molds, increase its hardness, prevent wear, improve electrical conductivity, lubricity, heat resistance and aesthetic appearance of the surface, prolong its service life and make more high quality products.
It has been found that the plating of the solder pad mold is more uniform than the hot dip layer and is generally relatively thin, typically only a few microns. By electroplating the substrate, it is possible to obtain decorative protection and various functional surface layers on the mechanical products, and also to repair wear and machining errors.
Most of the welding backing mold plating uses a single metal or alloy, such as titanium target, zinc, cadmium, gold or brass, bronze, etc.; there may also be dispersion layers, such as nickel-silicon carbide, nickel-fluoride. Graphite, etc.; some overlapping layers will also appear. In addition to iron-based steel and stainless steel, there will be non-ferrous metals such as ABS plastics, polypropylene, polysulfone, and phenolic plastics, but these materials must undergo special activation and sensitization before plating.